The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Mar. 25, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Young Kun Jee, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
The present disclosure relates to semiconductor packages. An example semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first bonding pad disposed on a first surface of the first semiconductor chip facing the second semiconductor chip, and a second bonding pad disposed on a second surface of the second semiconductor chip facing the first surface. The second bonding pad is in contact with the first bonding pad, and includes a third surface in contact with the first bonding pad and a fourth surface opposite to the third surface. The second semiconductor chip includes a first wiring pad in contact with the fourth surface and a second wiring pad spaced apart from the first wiring pad and the second bonding pad. A thickness of the second wiring pad is smaller than a thickness of the first wiring pad.