The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Oct. 10, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, forming a multi-layer photoresist on the first wiring structure, forming a plurality of openings in the multi-layer photoresist by exposing and developing the multi-layer photoresist, forming a plurality of conductive posts by forming a conductive material in the plurality of openings, removing the multi-layer photoresist, providing a semiconductor chip on the first wiring structure, forming an encapsulant on the semiconductor chip and the plurality of conductive posts, and forming a second wiring structure on the encapsulant, wherein the multi-layer photoresist includes at least two layers having different light transmittances.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile