The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Nov. 05, 2021
Nichia Corporation, Anan, JP;
Hajime Akimoto, Anan, JP;
NICHIA CORPORATION, Anan, JP;
Abstract
A manufacturing method includes: providing a substrate in which a semiconductor layer including a light-emitting layer is located on a first substrate; forming a metal layer on the semiconductor layer; bonding the semiconductor layer via the metal layer to a second substrate that includes a circuit that includes a circuit element is formed; forming a light-emitting element by patterning the semiconductor layer; forming a first wiring layer by patterning the metal layer; forming an insulating film that covers the light-emitting element and the first wiring layer; forming a first via that extends through the insulating film to the circuit; forming a second wiring layer on the insulating film; and connecting the light-emitting element and the circuit element electrically in series via the first wiring layer, the second wiring layer, and the first via.