The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jun. 01, 2022
Denso Corporation, Kariya-city, JP;
Sachio Kodama, Kariya-city, JP;
Hiroaki Yoshizawa, Kariya-city, JP;
Masanori Ooshima, Kariya-city, JP;
Takahiro Hirano, Kariya-city, JP;
DENSO CORPORATION, Kariya-city, JP;
Abstract
A semiconductor device includes a semiconductor element, a sealing member, and a first conductive plate. The semiconductor element includes a first electrode. The sealing member seals the semiconductor element. The first conductive plate includes a first surface facing the first electrode inside the sealing member. The first surface of the first conductive plate includes a mounting region, a roughened region and a non-roughened region. The first electrode is joined to the mounting region. The roughened region is located around the mounting region. The non-roughened region is located between the roughened region and an outer peripheral edge of the first surface. Surface roughness of the roughened region is larger than surface roughness of the non-roughened region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile