The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Sep. 12, 2023
Rohm Co., Ltd., Kyoto, JP;
Tsunehisa Ono, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A semiconductor device includes: semiconductor element; first lead having first section carrying the semiconductor element; second lead separated from the first lead and connected to the semiconductor element; and resin section covering the semiconductor element and portions of the first and second leads. The first section has first obverse surface and first reverse surface mutually facing away in a thickness direction. The semiconductor element has element obverse surface and element reverse surface mutually facing away in the thickness direction. The element reverse surface faces the first obverse surface. The resin section has resin obverse surface and resin reverse surface mutually facing away in the thickness direction. The first reverse surface is exposed from the resin reverse surface, and the area ratio of the first reverse surface to a region surrounded by the outer edge of the resin reverse surface is between 40% and 50%.