The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Apr. 30, 2021
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Yuki Nakano, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 72/90 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10D 30/66 (2025.01);
U.S. Cl.
CPC ...
H10W 72/90 (2026.01); H10W 74/01 (2026.01); H10W 74/147 (2026.01); H10D 30/668 (2025.01); H10W 72/926 (2026.01); H10W 72/983 (2026.01);
Abstract
A semiconductor device includes a semiconductor layer that has a main surface, a main surface electrode that is arranged at the main surface, an insulating film that partially covers the main surface electrode such as to expose a portion of the main surface electrode, a mold layer that covers the insulating film such as to expose the main surface electrode, and a pad electrode that is arranged on the main surface electrode such as to be electrically connected to the main surface electrode.