Circuit board and semiconductor package having the same

Abstract

A circuit board includes a build-up structure including a plurality of insulating layers stacked along a vertical direction; a solder resist layer disposed on the build-up structure and including a through hole; and a plurality of insulating members disposed on the solder resist layer and spaced apart from each other along a horizontal direction, an electronic device disposed on the through holes of the solder resist layer and including a plurality of terminals, wherein the build-up structure includes a plurality of pads overlapping the through hole of the solder resist layer along the vertical direction, the electronic device overlaps the plurality of insulating members along the vertical direction, the plurality of pads are electrically connected to the plurality of terminals of the electronic device, respectively, the solder resist layer includes a plurality of overlapping regions overlapping the plurality of insulating members along the vertical direction, and the through hole of the solder resist layer is disposed between the plurality of overlapping regions.