The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Oct. 03, 2023
Acer Incorporated, New Taipei City, TW;
Yu-Shih Wang, New Taipei City, TW;
Chih-Chun Liu, New Taipei City, TW;
Cheng-Nan Ling, New Taipei City, TW;
Wen-Chieh Tai, New Taipei City, TW;
Acer Incorporated, New Taipei City, TW;
Abstract
The invention provides an electronic package module including a chip, a heat-dissipation component, a carrying member, and a liquid metal. The carrying member is clamped between the chip and the heat-dissipation component. The carrying member has a porous structure. The liquid metal is filled in the porous structure to be in thermal contact with the chip and the heat-dissipation component. The liquid metal is constrained between the chip and the heat-dissipation component by the carrying member and does not flow outside of the chip and the heat-dissipation component.