Device module, manufacturing method therefor, and inductor-capacitor array

Abstract

A device module includes first and second conductive layers, and first and second functional layers between the first and second conductive layers. The first functional layer includes a plurality of capacitors and a plurality of via electrodes isolated from the plurality of capacitors. A plurality of inductors are formed in the second functional layer, each arranged along a thickness direction of the second functional layer. Thus, a first terminal of the inductor is electrically coupled with the first conductive layer through corresponding one of the via electrodes, and a second terminal of the inductor is electrically coupled with the second conductive layer. The device module simplifies the layout and wiring of a multi-phase circuit by directly installing the driver on the multi-inductor array with the pins being arranged longitudinally, and improves the effective utilization of inductor and capacitor materials.