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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12721112 B1

PDFFull Text
Date of Patent:
Aug. 25, 2026

Filed:

Feb. 02, 2023

Probe card for connecting to contact pads configured to act as probe pads of a semiconductor wafer

Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Guillaume Alexandre Blin, Carlisle, MA (US);

Engin Ibrahim Pehlivanoglu, Costa Mesa, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:

Knobbe, Martens, Olson & Bear, LLP

Primary Examiner:

Jarrett J Stark

Int. Cl.
CPC ...
H10P 74/00 (2026.01); G01R 1/073 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01); H10P 74/20 (2026.01); H10W 20/20 (2026.01); H10W 42/00 (2026.01); H10W 90/00 (2026.01); H10B 20/25 (2023.01); H10W 20/49 (2026.01);
U.S. Cl.
CPC ...
H10P 74/273 (2026.01); G01R 1/07342 (2013.01); G01R 31/2601 (2013.01); G01R 31/2884 (2013.01); H10P 74/207 (2026.01); H10P 74/23 (2026.01); H10P 74/277 (2026.01); H10W 20/20 (2026.01); H10W 42/00 (2026.01); H10W 90/00 (2026.01); H10B 20/25 (2023.02); H10W 20/493 (2026.01);
Abstract

A probe card for testing or trimming or programming a semiconductor wafer having a first die including a first integrated circuit having a trimmable or programmable component. The probe card includes at least one probe arranged to make electrical contact with a contact pad of a second die arranged adjacent to the first die. The contact pad of the second die being configured to act as a probe pad and being electrically connected to the trimmable or programmable component of the first die.

Find Patent Forward Citations

Blin, Guillaume. (2026). Probe card for connecting to contact pads configured to act as probe pads of a semiconductor wafer (U.S. Patent No. 12721112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12721112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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