The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Feb. 10, 2022
Mitsui Chemicals Ict Materia, Inc., Tokyo, JP;
Eiji Hayashishita, Nagoya, JP;
MITSUI CHEMICALS ICT MATERIA, INC., Tokyo, JP;
Abstract
A component manufacturing method includes: a step of arranging a plurality of electronic components in a state where electrodes are exposed, on a support having a substrate and a holding layer, with the holding layer interposed therebetween; and a step of evaluating electric characteristics of 80 or more of the electronic components among the electronic components arranged on the support by bringing all or some of the exposed electrodes and probes into contact with each other and simultaneously performing conduction evaluation. A component manufacturing film includes a resin base layer, the holding layer provided on one surface side of the resin base layer, and a joint layer that is provided on an opposite side of the resin base layer and bonds the component manufacturing film to the substrate. A component manufacturing tool includes the substrate and the holding layer provided to one surface of the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile