The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jun. 05, 2020
Applicant:

Nec Corporation, Tokyo, JP;

Inventors:

Katsumi Kikuchi, Tokyo, JP;

Akira Miyata, Tokyo, JP;

Suguru Watanabe, Tokyo, JP;

Takanori Nishi, Tokyo, JP;

Hideyuki Satou, Tokyo, JP;

Kenji Nanba, Tokyo, JP;

Ayami Yamaguchi, Tokyo, JP;

Assignee:

NEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/81 (2023.01); G06N 10/40 (2022.01); H01P 7/08 (2006.01);
U.S. Cl.
CPC ...
H10N 60/815 (2023.02); G06N 10/40 (2022.01); H01P 7/082 (2013.01);
Abstract

Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recessformed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.


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