The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Nov. 30, 2022
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Christopher P. Hussell, Raleigh, NC (US);

Boris Dzyubenko, Morrisville, NC (US);

Florin A. Tudorica, Chapel Hill, NC (US);

Michael Check, Holly Springs, NC (US);

Robert David Schmidt, Wake Forest, NC (US);

Joseph M. Favale, Jr., Cary, NC (US);

Zhenyu Zhong, Tseung Kwan O, HK;

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G11C 5/06 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H10B 51/10 (2023.01); H10B 51/20 (2023.01); H10H 20/80 (2025.01); H10H 20/851 (2025.01); H10H 20/852 (2025.01); H10H 20/855 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10H 20/856 (2025.01); H10H 20/8516 (2025.01); H10H 20/857 (2025.01);
Abstract

Light-emitting devices including solid-state light-emitting devices, light-emitting diode (LED) devices, and LED packages with support elements for improved near-field and far-field emissions are disclosed. LED chips may be mounted to support elements in a manner that directs light through the support elements in desired emission directions. Support elements include optical structures that spread and mix light laterally within the support element. Optical structures include various light-altering layers, such as light-diffusing layers or light-reflective layers, that are arranged to effectively increase internal reflections for lateral spreading of light. Patterned arrangements of light-altering layers include portions that mask direct emissions for LED chips, thereby redistributing emissions laterally to increase near-field and/or far-field uniformity across an increased portion of emitting surfaces. Support elements as described may be well suited for low profile LED devices where device heights are less than or equal to device widths.


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