The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Oct. 26, 2023
Applicant:

Taiwan-asia Semiconductor Corporation, Hsinchu City, TW;

Inventors:

Chuan-Wei Chen, Hsinchu City, TW;

Yen-Chun Tseng, Hsinchu City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); C09K 11/66 (2006.01); H01L 31/0216 (2014.01); H01L 31/103 (2006.01); H10F 30/221 (2025.01); H10F 77/122 (2025.01); H10F 77/1226 (2025.01); H10F 77/30 (2025.01); H10F 77/40 (2025.01); B82Y 20/00 (2011.01);
U.S. Cl.
CPC ...
H10F 77/496 (2025.01); C09K 11/66 (2013.01); H10F 30/221 (2025.01); H10F 77/122 (2025.01); H10F 77/1226 (2025.01); H10F 77/306 (2025.01); H10F 77/334 (2025.01); H10F 77/337 (2025.01); H10F 77/413 (2025.01); B82Y 20/00 (2013.01);
Abstract

The present disclosure provides a structure of an ultraviolet light sensing-enhanced photodiode. The main structure of the photodiode includes a silicon photodiode and an infrared conversion layer formed on a surface that receives an ultraviolet light of the of the silicon photodiode. When the ultraviolet light irradiates on the ultraviolet light sensing-enhanced photodiode through the infrared conversion layer, the infrared conversion layer converts the ultraviolet light into an infrared light. The first portion of the infrared light is propagated to the silicon photodiode and then converted to a photoelectric current. The second portion of the infrared light is absorbed by the infrared conversion layer. An infrared reflection layer is also provided for reflecting the third portion of the infrared light that is originally escaped from the infrared reflection layer, and the third portion of the infrared light can be reflected into the silicon photodiode.


Find Patent Forward Citations

Chen, Chuan-Wei. (2026). Structure of ultraviolet light sensing-enhanced photodiode (U.S. Patent No. 12720907). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12720907

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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