The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Dec. 05, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yoongi Joung, Hwaseong-si, KR;

Junghyun Kim, Suwon-si, KR;

Gyeongjin Lee, Suwon-si, KR;

Junsik Lee, Suwon-si, KR;

Jonghoon Park, Seoul, KR;

Yunki Lee, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/8063 (2025.01); H10F 39/024 (2025.01); H10F 39/182 (2025.01); H10F 39/806 (2025.01); H10F 39/807 (2025.01);
Abstract

A method of manufacturing an image sensor includes forming a first chip structure including a circuit wiring structure, forming a second chip structure on the first chip structure, the second chip structure including a plurality of photoelectric conversion device regions, forming a lens material layer on the second chip structure, forming an isolation groove defining a plurality of lens regions in the lens material layer, forming internal grooves in the plurality of lens regions of the lens material layer surrounded by the isolation groove, and forming lens patterns using the lens material layer in which the isolation groove and the internal grooves are formed.


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