The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Oct. 23, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Gukhee Kim, Suwon-si, KR;

Kyoungwoo Lee, Suwon-si, KR;

Sangcheol Na, Suwon-si, KR;

Minchan Gwak, Suwon-si, KR;

Youngwoo Kim, Suwon-si, KR;

Hojun Kim, Suwon-si, KR;

Dongick Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 84/85 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6729 (2025.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 62/121 (2025.01); H10D 84/85 (2025.01); H10W 20/427 (2026.01);
Abstract

A semiconductor device, comprising: first and second fin-type active patterns disposed on an upper surface of a substrate, and having different widths; first and second gate structures crossing the first and second fin-type active patterns, respectively; first and second source/drain regions disposed on the first and second fin-type active patterns, respectively; first and second contact structures connected to the first and second source/drain regions, respectively; a gate isolation structure adjacent to the first fin-type active pattern having a relatively large width; a buried conductive structure contacting one end surface of the gate isolation structure, and connected to the second contact structure; a conductive through-structure extending from a lower surface of the substrate, and connected to the buried conductive structure; and a first wiring layer electrically connected to the first contact structure and the buried conductive structure.


Find Patent Forward Citations

Kim, Gukhee. (2026). Semiconductor device (U.S. Patent No. 12720802). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12720802

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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