The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Sep. 06, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jumi Bak, Suwon-si, KR;

Eun-Young Lee, Suwon-si, KR;

Sunggil Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/40 (2023.01); G11C 16/04 (2006.01); H10B 41/10 (2023.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 41/41 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10B 80/00 (2023.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10B 43/40 (2023.02); G11C 16/0483 (2013.01); H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 41/41 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 80/00 (2023.02); H10W 90/00 (2026.01); H10W 90/752 (2026.01);
Abstract

A semiconductor device includes a semiconductor substrate, a peripheral circuit structure including peripheral circuits integrated on the semiconductor substrate and first bonding pads connected to the peripheral circuits, and a cell array structure including second bonding pads bonded to the first bonding pads. The cell array structure includes separation structures extending in a first direction, a stack disposed between the separation structures, a source conductive pattern disposed on the stack, vertical structures penetrating the stack and connected to the source conductive pattern, and reflection structures, which are vertically spaced apart from the source conductive pattern and are overlapped with the separation structures. The stack includes interlayer insulating layers and gate patterns, which are vertically and alternately stacked on top of one another.


Find Patent Forward Citations

Bak, Jumi. (2026). Semiconductor device and electronic system including the same (U.S. Patent No. 12720753). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12720753

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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