The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Feb. 28, 2024
Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Mark Summerville, Morrisville, NC (US);

Thomas Annunziata, Morrisville, NC (US);

Justin Ringuette, Morrisville, NC (US);

Mark Heidenfeldt, Morrisville, NC (US);

Sandy Collins, Morrisville, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20481 (2013.01);
Abstract

A multilayer thermal interface material includes: a first metal layer comprising a first metal; a second metal layer comprising a second metal; and an interposed layer disposed between the first metal layer and the second metal layer. The first metal layer, the second metal layer, and the interposed layer are in a solid state at or below a first temperature. The interposed layer is configured to change phase based on temperature and is in a phase other than a solid state at a second temperature, such that the first metal layer and the second metal layer contact each other.


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