The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Dec. 05, 2025
Cellink Corporation, San Carlos, CA (US);
Kevin Michael Coakley, Belmont, CA (US);
Jean-Paul Ortiz, White Lake, MI (US);
Malcolm Parker Brown, San Francisco, CA (US);
Robin Gorrell, Georgetown, TX (US);
CelLink Corporation, San Carlos, CA (US);
Abstract
Described herein are methods for forming welded connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a flexible circuit and an electrical component subassembly. The flexible circuit may comprise a first insulating layer, a conductive layer, and a second insulating layer. The conductive layer may comprise aluminum and may be stacked between the first insulating layer and the second insulating layer. The electrical component subassembly may comprise an electrical component and an interconnecting structure. The electrical component may comprise a base, a contact pad comprising copper and stacked with the base, and a component opening extending through each of the base and the contact pad. The interconnecting structure may be stacked between the contact pad and the conductive layer. The interconnecting structure may be attached to the contact pad and be welded to the conductive layer by a weld plug.