The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jan. 28, 2022
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Kenya Takimoto, Osaka, JP;

Naoki Shibata, Osaka, JP;

Hayato Takakura, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/05 (2013.01); H05K 2201/09927 (2013.01);
Abstract

A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.


Find Patent Forward Citations

Loading…