The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Oct. 23, 2023
Applicant:
Nec Corporation, Tokyo, JP;
Inventor:
Naoki Oshima, Tokyo, JP;
Assignee:
NEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H05K 1/0287 (2013.01); H05K 3/0005 (2013.01); H05K 2201/09409 (2013.01);
Abstract
A semiconductor substrate according to the present disclosure includes a high-frequency circuit, in which a size of each of dummy metal pieces and an interval of an arrangement of the dummy metal pieces constituting a dummy metal piece group in a first area which is inside a line constituting a high-frequency circuit is n times larger than that of a dummy metal piece group outside a peripheral area of the high-frequency circuit; and the number of the dummy metal pieces in the first area is 1/nof the number of the dummy metal pieces outside the peripheral area, where n is a real number greater than one.