The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Feb. 28, 2023
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Yoshiyuki Higuchi, Nagaokakyo, JP;
Masakazu Fukumitsu, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/17 (2006.01); H03H 3/007 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/171 (2013.01); H03H 3/0072 (2013.01); H03H 3/02 (2013.01);
Abstract
A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.