The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Sep. 26, 2024
Lapis Technology Co., Ltd., Yokohama, JP;
Yoshinori Yano, Yokohama, JP;
LAPIS TECHNOLOGY CO., LTD., Yokohama, JP;
Abstract
A multi-die module includes: a first semiconductor die having an internal line, an external electrode, and multiple internal electrodes and including a first control circuit that control a DC-DC converter; a second semiconductor die having multiple internal electrodes and including a second control circuit that controls a linear regulator; and a package that supports the first and second semiconductor dies. The second control circuit includes a voltage comparison circuit having a feedback input, a reference input, and a comparison output. In each of the first and second semiconductor dies, the multiple internal electrodes includes a first internal electrode. The feedback input of the voltage comparison circuit is connected to the first internal electrode of the second semiconductor die, which is connected to the first internal electrode of the first semiconductor die. The internal line connects the first internal electrode of the first semiconductor die to the external electrode.