The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Oct. 27, 2022
Denso Corporation, Kariya-city, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Mirise Technologies Corporation, Nisshin, JP;
Naoya Take, Nisshin, JP;
DENSO CORPORATION, Kariya-city, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
MIRISE Technologies Corporation, Nisshin, JP;
Abstract
A semiconductor device includes a semiconductor element, a substrate, and a plurality of wires. The semiconductor element has a plurality of electrodes on a first surface. The substrate has an element mount portion to which a second surface of the semiconductor element is joined through a solder joining material, a plurality of bonding portions disposed on a periphery of the element mount portion and spaced apart from each other, and a solder absorption portion extending outwardly from the element mount portion to receive a surplus of the solder joining material and being electrically independent of the plurality of bonding portions. The wires connect the electrodes and the bonding portions. The element mount portion and the solder absorption portion have a higher solder wettability than another portion of the substrate.