The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Nov. 14, 2022
Applicant:

Shibaura Machine Co., Ltd., Tokyo, JP;

Inventors:

Rintaro Sueki, Numazu, JP;

Kazuhiro Fukada, Sunto-gun, JP;

Takeshi Namba, Numazu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 14/00 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); C23C 14/0063 (2013.01); H01J 37/32715 (2013.01); H01J 37/32834 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/332 (2013.01);
Abstract

A surface treatment apparatus () performs film formation on a surface of a workpiece (W) in a chamber (), and includes: an HCD electrode () (electrode) that supplies reaction gas to the workpiece (W) or a sputtering electrode () (electrode) that releases target particles to the workpiece (W), the HCD electrode () or the sputtering electrode () being placed facing the workpiece (W); a gas supply pipe () that is installed along an outer periphery of the electrode and has, along a longitudinal direction of the pipe, a plurality of gas ejection ports () through which film-forming gas, or an inert gas or a reactive gas for performing sputtering is supplied to an electrode surface of the electrode; and an exhaust device () (gas discharge unit) that discharges residual gas after film formation is ended, and the plurality of gas ejection ports () are arranged such that gas supplied from the gas supply pipe () is uniformly distributed on the electrode surface of the electrode.


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