The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Dec. 21, 2023
Applicant:
Pratt & Whitney Canada Corp., Longueuil, CA;
Inventor:
Michael Morash, Avondale, CA;
Assignee:
PRATT & WHITNEY CANADA CORP., Longueuil, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); B29C 37/00 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); B29L 31/08 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); B29C 37/00 (2013.01); G01N 21/8806 (2013.01); G01N 21/8851 (2013.01); G01N 21/9515 (2013.01); B29C 2037/90 (2013.01); B29L 2031/08 (2013.01); G01N 2021/8854 (2013.01); G01N 2201/061 (2013.01); G06T 2207/30136 (2013.01);
Abstract
A method of qualifying an addition die includes the steps of obtaining a master die that has been certified, and performing a master 3D scan on the master die. A second 3D scan is performed on an additional die made according to original specifications of the master die. The second 3D scan is compared to the master 3D scan of the master die. Then, the additional die is certified for production should the second 3D scan of the additional die be acceptably close to the master 3D scan of the master die.