The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Nov. 19, 2024
Applicant:

Bank of America Corporation, Charlotte, NC (US);

Inventor:
Assignee:

Bank of America Corporation, Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/50 (2006.01); G06F 9/54 (2006.01);
U.S. Cl.
CPC ...
G06F 9/5088 (2013.01); G06F 9/5094 (2013.01); G06F 9/54 (2013.01); G06F 2209/5022 (2013.01); G06F 2209/509 (2013.01); G06F 2209/543 (2013.01);
Abstract

The invention provides a reversible logic gate-based thermal management system with a dedicated entropy offloading unit (TOU) for high-performance processors. Reversible logic gates are deployed in high-computational regions to minimize the conversion of information entropy conversion to heat, while non-reversible gates are used in low-computation regions. A real-time entropy offloading module dynamically transfers excess entropy from high-entropy regions to the TOU, where cascading non-reversible gates handle irreversible computations. The TOU is thermally isolated from the processor cores, and heat generated within the TOU is managed by a modular cooling system incorporating both passive and active components. The system employs thermal imaging sensors and predictive models to monitor and adjust entropy offloading rates and cooling mechanisms based on real-time and historical thermal data. This architecture ensures sustained processor performance while preventing overheating through efficient entropy management and dynamic heat regulation. The system is designed to be scalable for future computational demands.


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