The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jan. 28, 2021
Applicant:

Designer Molecules, Inc., San Diego, CA (US);

Inventor:

Farhad Mizori, San Diego, CA (US);

Assignee:

DESIGNER MOLECULES, INC., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/038 (2006.01); H10W 46/00 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01); H10W 70/652 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/47 (2026.01);
U.S. Cl.
CPC ...
G03F 7/0048 (2013.01); G03F 7/0382 (2013.01); H10W 46/00 (2026.01); H10W 70/09 (2026.01); H10W 74/01 (2026.01); H10W 74/121 (2026.01); H10W 74/47 (2026.01); H10W 46/103 (2026.01); H10W 70/60 (2026.01); H10W 70/6528 (2026.01); H10W 72/248 (2026.01); H10W 72/853 (2026.01);
Abstract

Hydrophobic, tough, photoimageable, functionalized polyimide formulations have been discovered that can be UV cured and developed in cyclopentanone. The present invention formulations can be used as passivation and redistribution layers with patterning provided by photolithograph, for the redistribution of I/O pads on fan-out RDL applications. The curable polyimide formulations reduce stress on thin wafers, when compared to conventional polyimide formulations, and provide low modulus, hydrophobic solder mask. These materials can serve as protective layers in any applications in which a thin, flexible, and hydrophobic polymer is required, that also has high tensile strength and high elongation at break.


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