The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Mar. 28, 2019
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Tomokazu Kusunoki, Osaka, JP;
Kanji Sakuragi, Osaka, JP;
Shinji Fujimoto, Aichi, JP;
Koichi Masukawa, Kyoto, JP;
Panasonic Housing Solutions Co., Ltd., Osaka, JP;
Abstract
A resin molded body includes a resin structure, an intermediate layer including an inorganic filler and an organic resin binder and provided on a surface of at least a part of the resin structure, and a thermal sprayed ceramic coating provided on the intermediate layer. The inorganic filler is amorphous in shape and has a central particle diameter of 20 μm or more and 100 μm or less. The intermediate layer has a thickness of 50 μm or more and 250 μm or less. The central particle diameter a of the inorganic filler and the thickness b of the intermediate layer satisfy the relationship of b≥2a, and the inorganic filler is contained in the intermediate layer in an amount of 40% to 65% as a volume ratio.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile