The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Mar. 28, 2023
Applicant:

Sekisui Polymatech Co., Ltd., Saitama, JP;

Inventors:

Kenta Kuroo, Saitama, JP;

Hiromichi Iwazaki, Saitama, JP;

Hiroki Kudoh, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); B32B 7/12 (2006.01); C09J 5/06 (2006.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); B32B 7/12 (2013.01); C09J 5/06 (2013.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09K 5/14 (2013.01); B32B 2307/302 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2301/414 (2020.08);
Abstract

Provided is a heat-conductive sheet including: a binder component that is a mixture of a silicone matrix (A) and an alkyl silicone compound (B); and a heat-conductive filler (C) dispersed in the binder component, a content of the alkyl silicone compound (B) being 2.0 to 20 parts by mass with respect to 100 parts by mass of a total of the silicone matrix (A) and the alkyl silicone compound (B), and the heat-conductive sheet having an expansion coefficient X of −2.0% or more and less than 0%, as measured by a thermomechanical analyzer (TMA) in the conditions of a compressive load of 0.01 N, a measurement temperature of 30 to 80° C., and a heating rate of 2° C./minute.


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