The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Aug. 29, 2023
Applicant:

Moriroku Technology Company, Ltd., Tokyo, JP;

Inventors:

Mitsuru Suzuki, Tokyo, JP;

Takashi Tanaka, Tokyo, JP;

Assignee:

MORIROKU CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60R 13/00 (2006.01);
U.S. Cl.
CPC ...
B60R 13/005 (2013.01);
Abstract

A resin-molded article is configured so that a body having a design surface and a clip attachment member which is formed on a back surface of the design surface of the body and to which a clip is attachable, the body and the clip attachment member being integrally formed. The clip attachment member includes an attachment wall raised from the back surface, and a rib extending from the attachment wall to the back surface and reinforcing the attachment wall. A through-hole penetrating through the attachment wall is formed at a position adjacent to the rib of the attachment wall.


Find Patent Forward Citations

Suzuki, Mitsuru. (2026). Resin-molded article (U.S. Patent No. 12715373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12715373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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