The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jan. 05, 2024
Canon Kabushiki Kaisha, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for manufacturing a liquid ejection head including an element substrate having an ejection port forming member including an ejection port and an energy generating element for supplying energy for ejecting liquid to the ejection port includes preparing a wafer having the energy generating element and the ejection port forming member on a first surface, forming a recessed portion in a second surface, and cutting the wafer. The wafer is cut along cutting lines provided on the first surface to form element substrates and including a first cutting line and a second cutting line intersecting the first cutting line. The recessed portion is formed at a position overlapping the cutting lines except in an intersection portion of the first and second cutting lines. In the intersection portion, the recessed portion is formed corresponding to only one of the first cutting line and the second cutting line.