The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Dec. 15, 2022
Applicant:

Darkvision Technologies Inc., North Vancouver, CA;

Inventors:

Michael Halpenny-Mason, North Vancouver, CA;

Jeffrey Scott Jordan, Indianapolis, IN (US);

Assignee:

DarkVision Technologies Inc., North Vancouver, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 29/24 (2006.01); B06B 1/06 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0685 (2013.01); B06B 1/067 (2013.01); G01N 29/245 (2013.01);
Abstract

An acoustic device and method of manufacturing same. The device may be used to inspect tubulars and parts with high resolution. The acoustic device may include a 2D ultrasonic transducer layer and an ASIC connected to each other by an array of conductive wires. A non-conductive, acoustic damping material is flowed and set around the wires, to form a thick acoustic backing layer. Manufacturing the ultrasonic transducer may involve wire bonding. Electrical Discharge Machining or supporting rigid posts on a substrate. A surface of the backing layer may be machined, plated and diced to create conductive pads to connect the transducer layer to the wires then to the ASIC.


Find Patent Forward Citations

Halpenny-Mason, Michael. (2026). Ultrasound interconnect stack and method of manufacturing same (U.S. Patent No. 12715021). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12715021

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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