The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
Mar. 28, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Myung Chan Son, Suwon-si, Gyeonggi-do, KR;
Yong Park, Suwon-si, Gyeonggi-do, KR;
Jong Ho Lee, Suwon-si, Gyeonggi-do, KR;
Eun Jung Lee, Suwon-si, Gyeonggi-do, KR;
Jung Tae Park, Suwon-si, Gyeonggi-do, KR;
Min Woo Kim, Suwon-si, Gyeonggi-do, KR;
Ji Hyeon Lee, Suwon-si, Gyeonggi-do, KR;
Sun Mi Kim, Suwon-si, Gyeonggi-do, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., SUWON-SI, GYEONGGI-DO, KR;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H01G 4/005 ; H01G 4/232 ; H01G 4/30 ; H01G 13/00 ; C04B 35/4686 ; C04B 35/64 ; C04B 2235/6025 ; C04B 2235/6582 ; C04B 2237/68 ; H01G 2/065 ; H01G 4/008 ; H01G 4/012 ; H01G 4/12 ; H01G 4/1209 ;
Son, Myung Chan. (2026). Method of manufacturing multilayer electronic component (U.S. Patent No. 12712131). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12712131
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile