The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Sep. 29, 2021
Rohm Co., Ltd., Kyoto, JP;
Hiroaki Matsubara, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
A semiconductor device includes first and second circuits, and an insulator relaying signals between the first and second circuits. The first circuit includes a first pad and a first semiconductor mounted on the first pad. The second circuit includes a second pad and a second semiconductor mounted on the second pad. The insulator may be mounted on the first pad. The semiconductor device further includes wire bonded to the insulator and second semiconductor. The wire includes an upright, inclined and extended sections. The upright section rises from the insulator along a thickness direction of the first pad. The inclined section is inclined relative to the thickness direction, extending from the second semiconductor toward the insulator. The extended section is between the upright and the inclined sections. The inclination angle of the extended section to a plane perpendicular to the thickness direction is smaller than that of the inclined section.