The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Mar. 23, 2023
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Tsuyoshi Takakura, Nagaokakyo, JP;

Ryoichi Kita, Nagaokakyo, JP;

Hideo Nakagoshi, Nagaokakyo, JP;

Hiroki Yoshimori, Nagaokakyo, JP;

Tadashi Nomura, Nagaokakyo, JP;

Yoshihito Otsubo, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 90/701 (2026.01); H10W 70/611 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 74/117 (2026.01); H10W 74/131 (2026.01); H10W 90/00 (2026.01);
Abstract

A substrate structure comprises a substrate having a first surface, a first electrode disposed on the first surface, a bump connected to the first electrode, and a protective member that covers the first surface and covers a portion of the bump. The protective member has an opening. The bump includes a portion exposed through the opening. The bump includes a first portion that is connected to the first electrode, and a second portion that is located farther from the first electrode than the first portion and is connected to the first portion. The bump has a constriction at a boundary between the first portion and the second portion. When viewed in a direction perpendicular to the first surface, a maximum diameter of the second portion is smaller than a maximum diameter of the first portion.


Find Patent Forward Citations

Takakura, Tsuyoshi. (2026). Substrate structure, module, method for manufacturing the substrate structure, and method for manufacturing the module (U.S. Patent No. 12708055). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12708055

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…