The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Jul. 14, 2022
Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Yifan Wu, Beijing, CN;
Yue Li, Beijing, CN;
Yuelei Xiao, Beijing, CN;
Xiaodong Li, Beijing, CN;
Jingshu Zhang, Beijing, CN;
Kidong Han, Beijing, CN;
Yulin Feng, Beijing, CN;
Qichang An, Beijing, CN;
Yingwei Liu, Beijing, CN;
Zijian Wang, Beijing, CN;
Rui MA, Beijing, CN;
Quanyue Li, Beijing, CN;
Song Chen, Beijing, CN;
Qianyu Guo, Beijing, CN;
Biqi Li, Beijing, CN;
BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
A composite substrate, a method for manufacturing a composite substrate, and an electronic device are provided. The composite substrate includes a package substrate and an interposer which are stacked; the interposer includes: a first dielectric substrate including a first connection via penetrating therethrough, and a first surface and a second surface opposite to each other; a first connection electrode in the first connection via; and a first connection structure and a second connection structure respectively on the first surface and the second surface and both connected to the first connection electrode; the package substrate includes: a second dielectric substrate on a side of the second connection structure away from the first dielectric substrate; a third connection structure and a fourth connection structure which are on the second dielectric substrate and electrically connected; the third connection structure being electrically connected to the first connection electrode through the second connection structure.