The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Jan. 18, 2022
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/15 (2026.01); H10W 74/01 (2026.01); H10W 74/47 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/30 (2026.01); H10W 90/00 (2026.01); H10W 99/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/15 (2026.01); H10W 74/012 (2026.01); H10W 74/47 (2026.01); H10W 72/01223 (2026.01); H10W 72/01323 (2026.01); H10W 72/072 (2026.01); H10W 72/07231 (2026.01); H10W 72/07234 (2026.01); H10W 72/07236 (2026.01); H10W 72/07237 (2026.01); H10W 72/073 (2026.01); H10W 72/07334 (2026.01); H10W 72/07338 (2026.01); H10W 72/241 (2026.01); H10W 72/332 (2026.01); H10W 72/354 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01); H10W 99/00 (2026.01);
Abstract
A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.
Choi, Tae. (2026). Semiconductor package and manufacturing method therefor (U.S. Patent No. 12708031). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12708031
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile