The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Sep. 06, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jaemyung Choi, Niskayuna, NY (US);
Janggeun Lee, Delmar, NY (US);
Wonhyuk Hong, Clifton Park, NY (US);
Kang-Ill Seo, Albany, NY (US);
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Integrated circuit devices and methods of forming the same are provided. The methods may include providing an underlying structure including a first insulating layer and forming a first metal structure, a first adhesion pattern, and a second insulating layer thereon. The second insulating layer may be on a side surface of the first metal structure, the first metal structure may include a metal pattern and a second adhesion pattern between the first insulating layer and the metal pattern, and the first adhesion pattern contacts side surfaces of the metal pattern and the second adhesion pattern. The methods may also include forming a second metal structure on the first metal structure. The metal pattern may include a contact portion protruding upwardly beyond an upper surface of the second insulating layer or may include an upper surface recessed with respect to the upper surface of the second insulating layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile