The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Jan. 26, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yongho Kim, Suwon-si, KR;
Sunoo Kim, Suwon-si, KR;
Jinwoo Kim, Suwon-si, KR;
Boin Noh, Suwon-si, KR;
Sejun Park, Suwon-si, KR;
Jaehee Oh, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor device includes a semiconductor substrate, a connection pad disposed on an interlayer insulating layer and electrically connected to an interconnection structure, a passivation layer disposed on the connection pad and having a first opening and a second opening, each exposing at least a portion of the connection pad, a first bump that includes a first lower conductive layer in contact with the connection pad within the first opening and a first upper conductive layer on the first lower conductive layer, and a second bump that includes a second lower conductive layer in contact with the connection pad within the second opening and a second upper conductive layer on the second lower conductive layer. The first and second lower conductive layers include the same material, and the first upper conductive layer and the second upper conductive layer include different materials.