The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Jun. 20, 2022
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Masaki Inaba, Kyoto, JP;

Eiji Umeda, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01); H10P 50/64 (2026.01); H10P 72/00 (2026.01); H10P 72/76 (2026.01); H10P 50/00 (2026.01); H10P 52/00 (2026.01); H10P 76/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0424 (2026.01); H10P 50/642 (2026.01); H10P 72/0408 (2026.01); H10P 72/0414 (2026.01); H10P 72/7618 (2026.01); H10P 50/00 (2026.01); H10P 52/00 (2026.01); H10P 72/0406 (2026.01); H10P 76/00 (2026.01);
Abstract

A substrate processing method processes a substrate having a first principal surface that has a first peripheral edge portion, a second principal surface that has a second peripheral edge portion, and an outer peripheral end that couples the first peripheral edge portion and the second peripheral edge portion. The method includes a protection film forming step of supplying a protection film formation liquid to the first principal surface and forming a protection film in the first peripheral edge portion, a first chemical liquid supplying step of supplying a chemical liquid to the second principal surface, allowing the chemical liquid to reach the outer peripheral end, and processing the outer peripheral end with the chemical liquid in a state where the protection film is formed in the first peripheral edge portion, and a protection film removing step of removing the protection film after the first chemical liquid supplying step.


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Inaba, Masaki. (2026). Substrate processing method and substrate processing device (U.S. Patent No. 12707917). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12707917

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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