The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Dec. 27, 2021
Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Jianchang Cai, Beijing, CN;
Qing Tang, Beijing, CN;
Yu Zhao, Beijing, CN;
Yanwei Lu, Beijing, CN;
Jianmin Fan, Beijing, CN;
Binyan Wang, Beijing, CN;
Yue Long, Beijing, CN;
Weiyun Huang, Beijing, CN;
Zhuoran Yan, Beijing, CN;
Yifei Wang, Beijing, CN;
Chengdu BOE Optoelectronics Technology Co., Ltd., Chengdu, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
A display substrate comprises a base substrate, a first conductive layer, a first planarization layer, a second conductive layer, a second planarization layer and at least one transparent conductive layer. The second conductive layer is electrically connected with the first conductive layer through at least one first via penetrating the first planarization layer. The transparent conductive layer includes at least one first transparent conductive line and at least one auxiliary trace. An orthographic projection of the first transparent conductive line on the base substrate is overlapped with an orthographic projection of the at least one first via on the base substrate. At least a portion of the auxiliary traces are in the same direction as an extension direction of the first transparent conductive line, and an orthographic projection of the auxiliary traces on the base substrate is adjacent to an orthographic projection of the first via on the base substrate.