The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Aug. 29, 2022
Hefei Boe Ruisheng Technology Co., Ltd., Hefei, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Jie Lei, Beijing, CN;
Jian Tian, Beijing, CN;
Chunjian Liu, Beijing, CN;
Jianying Zhang, Beijing, CN;
Yajun MA, Beijing, CN;
Jiawei Xu, Beijing, CN;
Hefei BOE Ruisheng Technology Co., Ltd., Hefei, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
Provided is a wiring substrate. The wiring substrate includes: a base, including a functional region, a bonding region, and a connecting region; a first conductive layer, disposed on a side of the base and in the functional region and the connecting region; a first insulative layer, disposed on a side of the first conductive layer and in the functional region, the connecting region, and the bonding region, wherein a first via is defined in a portion of the first insulative layer and is configured to expose the first conductive layer; a second conductive layer, disposed on a side of the first insulative layer and in the connecting region and the bonding region, and electrically connected to the first conductive layer; and a second insulative layer, disposed on a side of the second conductive layer and in the connecting region and the functional region.