The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Dec. 28, 2021
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Shunsaku Hanaoka, Kumamoto, JP;
Takuya Nakamura, Kanagawa, JP;
Shumpei Aoki, Kanagawa, JP;
Yukihide Keigo, Kumamoto, JP;
Eiichirou Kishida, Kumamoto, JP;
Ayaka Seki, Kumamoto, JP;
Yuji Hara, Kumamoto, JP;
Seigi Ono, Kumamoto, JP;
Junki Komori, Kumamoto, JP;
Takayuki Tanaka, Kumamoto, JP;
Tomohiko Baba, Kanagawa, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
Miniaturization is facilitated in a semiconductor package provided with pixels. A semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In this semiconductor package, pixels are arranged on a part of a chip plane of the semiconductor chip. The photosensitive rib is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane of the semiconductor chip and the transparent member. Furthermore, the interposer is electrically connected to the semiconductor chip.