The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Apr. 14, 2023
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Ki Hyun Kim, Yongin-si, KR;

Young Gil Park, Yongin-si, KR;

Won Bong Baek, Yongin-si, KR;

Young Uook Lee, Yongin-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10W 90/00 (2026.01); H10W 72/20 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10D 86/60 (2025.01); H10D 86/441 (2025.01); H10W 90/00 (2026.01); H10D 86/411 (2025.01); H10W 72/242 (2026.01); H10W 72/90 (2026.01); H10W 72/923 (2026.01); H10W 72/9415 (2026.01); H10W 72/942 (2026.01); H10W 72/944 (2026.01); H10W 72/953 (2026.01); H10W 90/724 (2026.01); H10W 90/792 (2026.01);
Abstract

A display device includes a substrate having a first surface in which a light-emitting element is disposed, a second surface, and a first lateral side; a connecting electrode disposed on the first surface; a first insulating layer disposed on the connecting electrode and including a contact hole; a first upper pad electrode electrically connected to the connecting electrode, the first upper pad electrode having a first thickness in an area not overlapping the contact hole and having a second thickness in an area overlapping the contact hole; a second upper pad electrode disposed on the first upper pad electrode and having a substantially flat profile; a lower pad disposed on the second surface of the substrate; and a side wiring electrically connecting the second upper pad electrode and the lower pad, the side wiring surrounding the first surface, the first lateral side, and the second surface of the substrate.


Find Patent Forward Citations

Loading…