The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Nov. 14, 2023
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Kazushiro Nomura, Kawasaki Kanagawa, JP;
Kenichi Ohashi, Kawasaki Kanagawa, JP;
Soichi Yamashita, Kawasaki Kanagawa, JP;
Kentaro Mori, Fujisawa Kanagawa, JP;
Aya Murayoshi, Ichihara Chiba, JP;
Hiroki Okuyama, Yokohama Kanagawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Toshiba Electronic Devices & Storage Corporation, Kawasaki, JP;
Abstract
A semiconductor device according to an embodiment includes a first electrode having a first main surface and a second main surface opposite to the first main surface, a semiconductor substrate disposed on the second main surface, and a second electrode disposed on a fourth main surface of the semiconductor substrate opposite to a third main surface in contact with the first electrode. The first electrode has a first side surface substantially perpendicularly intersecting with the first main surface, and a second side surface substantially perpendicularly intersecting with both the first main surface and the first side surface, and the first main surface, the first side surface, and the second side surface are connected to each other via a curved surface.