The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Nov. 09, 2022
Hitachi Astemo, Ltd., Hitachinaka, JP;
Ti Chen, Tokyo, JP;
Takeshi Tokuyama, Tokyo, JP;
Takahiro Araki, Tokyo, JP;
Junpei Kusukawa, Tokyo, JP;
Hiromi Shimazu, Tokyo, JP;
Akihiro Namba, Tokyo, JP;
HITACHI ASTEMO, LTD., Hitachinaka, JP;
Abstract
This semiconductor device comprises: a plurality of power modules, each having a semiconductor element; a plurality of heat dissipation bases that are disposed via heat dissipation members on a heat dissipation surface side of the plurality of power modules, and that each have a heat dissipation fin; a frame having a plurality of openings; and a cover that covers the heat dissipation bases and the frame so as to form a refrigerant flow passage. The plurality of heat dissipation bases respectively close the plurality of openings. The cover has an elastic biasing part on a surface which contacts the heat dissipation fins. The heat dissipation bases are biased, by pressurization, toward the power modules.