The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
May. 08, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Bongkyu Min, Suwon-si, KR;
Taewoo Kim, Suwon-si, KR;
Jinyong Park, Suwon-si, KR;
Hyelim Yun, Suwon-si, KR;
Hyeongju Lee, Suwon-si, KR;
Jiseon Han, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An electronic device is provided. The electronic device includes a base plate, a first component disposed on the base plate, a second component which is disposed on the base plate and provided at a position spaced apart from the first component, an interposer which is connected to the base plate and surrounds the first component and the second component, a cover plate including a cover plate body which is connected to the interposer and covers the first component and the second component, and a cover hole which is formed to penetrate the cover plate body, and a heat dissipation plate including a heat dissipation plate body which is disposed on the cover plate body and faces the first component and the second component, a heat dissipation hole which is formed to penetrate the heat dissipation plate body and communicates with the cover hole, and a flow guide which is formed on the heat dissipation plate body and guides the flow of a thermal interface material.