The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Aug. 15, 2022
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Dianying Tang, Shanghai, CN;

Jie Liu, Shanghai, CN;

Jiafeng Ding, Shanghai, CN;

Min Zhang, Shanghai, CN;

Hao Zhang, Suzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2026.01); H04M 1/02 (2006.01); H04M 1/18 (2006.01); H05K 5/06 (2006.01); H05K 1/189 (2026.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); H04M 1/0277 (2013.01); H04M 1/18 (2013.01); H04M 1/0214 (2013.01); H05K 1/189 (2013.01);
Abstract

A FPC mounting module includes a mounting part and an FPC. The mounting part is provided with a mounting hole, the FPC penetrates the mounting hole, and there is a gap between the FPC and an inner wall surface of the mounting hole. A first surface of the FPC is glued to a first wall surface of the mounting hole by using a first adhesive part. The gap is filled with flowing adhesive, to form a second adhesive part. The FPC is sealed in and fastened to the mounting hole by using the second adhesive part.


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