The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Dec. 16, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Sang Myung Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); H05K 1/0271 (2013.01); H05K 1/116 (2013.01); H05K 3/107 (2013.01); H05K 3/188 (2013.01); H05K 2203/095 (2013.01);
Abstract

A circuit board according to an embodiment includes an insulating layer including a cavity; and a metal layer disposed on an inner wall of the cavity of the insulating layer, wherein at least one recess concave toward the inside of the insulating layer is formed on an inner wall of the cavity, wherein the metal layer includes: a first metal layer disposed on the inner wall of the cavity while filling the recess; and a second metal layer disposed on the first metal layer and disposed on the inner wall of the cavity.


Find Patent Forward Citations

Lee, Sang. (2026). Circuit board (U.S. Patent No. 12707563). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12707563

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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